Additive manufacturing of three-dimensional metal structures by photoelectrochemical methods

Description:

Technology # 19-44

 

 

Additive manufacturing of metals generally involves laser-sintered metal powders for large parts and large feature sizes. Nanometer-to-micrometer-scale features, like those of interest to plasmonic, microelectronic, optoelectronic, catalytic and other applications, require the metallization of 3D-printed templates. The templates are formed on expensive two-photon 3D-printing systems and are generally small in extent (a few square millimeters) and slow to produce, making this a difficult strategy for scale-up. We have invented a bench-top, chemical process to form three-dimensional, microstructure noble metal interfaces without a clean room or costly capital equipment. Our current capabilities can achieve feature sizes of 10 microns, though we are aiming to improve our feature sizes (down to 1 micron) in the next year. Our process is completely parallel in area, meaning that it takes the same amount of time to grow three dimensional features in 1 mm^2, 1 cm^2, or even across an entire wafer. Unlike other metallization processes (evaporation, sputtering) that waste a majority of the materials that go into the process, our approach is atom-efficient. Every atom of expensive noble metal feedstock used in our process goes into the deposited layer, rather than all over the surface of the deposition chamber and lift-off layer.  

 

Some Target Application(s):

 

3D printing and additive manufacturing, micro fabrication, microelectronics, plasmonics, electromagnetic sensing or imaging applications (antennae for concentrating fields across the electromagnetic spectrum (surface-enhanced Raman spectroscopy, metamaterials for ); lenses/zone plates), multi layer mirrors, lenses, or other optics for x-ray applications, flexible electronics, flexible sensors or detectors, multi layer electronics, catalysts, multi-metal metallization processes  

 

Advantage(s):

 

* Benchtop process

* Low cost process

* Down to 1 micron feature sizes

* Massively parallel, large area deposition

* Energy and atom efficient deposition

 

Technology:

 

This invention is based on a deposition-noble metal replacement procedure as a method for fabricating three-dimensional nanostructures or micro structures 

 __________________________________________

This invention/technology is available for licensing.

For interested parties seeking further information, feel free to contact:

Mark Allen Lanoue

Technology Manager / Tech Ventures

University of Arkansas

(479) 575-7243

malanoue@uark.edu

 

Patent Information:
For Information, Contact:
Mark Lanoue
Technology Manager
University of Arkansas
479-575-7243
malanoue@uark.edu
Inventors:
Robert Coridan
James Lowe
Keywords:
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