Additively manufactured, non-conducting, convective heat removal device


Technology # 19-15


A novel technology for non-conducting convective heat removal


With regards to cooling down high-powered electronics, there is a constant battle between power and weight. Ideally, we strive to achieve a powerful system while maintaining a low profile; however, in reality this extra power creates a need for more efficient cooling systems. Generally, these systems, such as cold plates and heat sinks, are heavy and provide non-uniform cooling across the heat-generating devices. Reliability is therein reduced due to inconsistent damage across the system. The non-metallic localized heat-spreading device addresses both of these issues. First, the non-metallic material composition minimizes the weight needed for adequate cooling. Additionally, by using non-metals, we can avoid EMI resonance typically present with conventional techniques. Secondly, the localized heat spreading capability increases the reliability of an electrical system by decreasing maximum hot-spot temperatures and creating uniform thermal distributions. Therefore we can predict with greater confidence how a system degrades overtime and reduce how often electrical components need replacing.




•       Generators, specifically the conversion of mechanical energy to electrical energy

•       Increasing reliability in harvesting renewable energy (wind, solar, hydro-mechanical, geothermal, etc.)

•       Hybrid and fully electric aircraft propulsion systems, consumer electric vehicles and heavy machinery equipment

•       General electronic equipment (processors, servers, power distribution hubs)





•       Light-weight

•       Hot-spot mitigation

•       Uniform cooling distribution

•       Variable cooling performance to accommodate real-world heat loads

•       Low EMI resonance created

•       Modular design for application flexibility





A novel cooling system replacement



This invention/technology is available for licensing.

For interested parties seeking further information, feel free to contact:

Mark Allen Lanoue

Technology Manager / Tech Ventures

University of Arkansas

(479) 575-7243



Patent Information:
For Information, Contact:
Mark Lanoue
Technology Manager
University of Arkansas
Reece Whitt
David Huitink
Bakhtiyar Nafis
Fang Luo
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