A Technique to Reduce the Thermal Resistance of Semiconductor Substrates

Description:

Technology # 18-29

 

A System for reducing the thermal resistance of semiconductor substrates

 

Operation of a power semiconductor device generates a great amount of heat in the active layer which needs to be dissipated. This has been a limitation for many high power devices as the temperature for the junction cannot exceed a specific value. Not all the substrates are capable of dissipating the generated heat at higher power densities as they may not possess a sufficiently high thermal conductivity. A technique for improving the thermal properties of the substrate and relaxing thermal constraints is proposed which deals with reducing the thermal resistance of the region surrounding the active device. A simulation is conducted using the conduction heat transfer model and the efficiency of the procedure is investigated for different substrate materials.

 

Application(s):

 

This idea might be of interest for all the technologies utilizing small signal amplifiers, power amplifiers, mixers, and oscillators operating over a wide frequency range. The other category of applications is the RF design where the devices are used in cellular communications and RADARs in an integrated circuit configuration. A very good example of this category is the 5G technology.

 

Advantage(s):

 

The generality of this technique is probably its biggest advantage. The idea might be used for different substrate materials with different thicknesses and thermal conductivities. Any high-power platform may gain advantage of this method. 

 

Technology:

 

 A technique for improving the thermal properties of the substrate and relaxing thermal constraints is proposed which deals with reducing the thermal resistance of the region surrounding the active device.

 

 __________________________________________

This invention/technology is available for licensing.

For interested parties seeking further information, feel free to contact:

Mark Allen Lanoue

Technology Manager / Tech Ventures

University of Arkansas

(479) 575-7243

malanoue@uark.edu

 

Patent Information:
For Information, Contact:
Mark Lanoue
Technology Manager
University of Arkansas
479-575-7243
malanoue@uark.edu
Inventors:
Samir El-Ghazaly
Amirreza Avval
Gregory Salamo
Shui-Qing (Fisher) Yu
Keywords:
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