Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling

Description:

Technology # 18-30

 

Enhanced Heat Sink with Helical Fin Design for Electronics Cooling

 

In electronics, an increase in heat transfer is caused by the presence of cooler fluid coming into contact with hotter fluid. In other words, as the fluid passes over the heat sink, it heats up. There is a new invention for a helical fin design heat sink that allows for the warm fluid to come into contact with cooler areas and recirculate throughout the system further cooling the fins. Due to the current industry’s interest in developing non-metallic heat sinks to avoid issues with high density electrical systems, this method has the potential to have a large impact.

 

Application(s):

 

Electronics cooling, such as PCs, TVs, vehicle onboard electronics, power inverter systems (solar panels, vehicle chargers, motor drives) and other heat rejection schemes such as radiators etc.

 

Advantage(s):

 

* This additively manufactured heat sink is able to provide significantly better cooling than its conventional counterparts, while also resulting in more uniform cooling across the area regardless of flow direction.

 

* Improved heat rejection for similar fan flow rate, or alternatively, reduced fan power for similar heat rejection from heated elements. Can be customized to heat source since AM opens up customizable designs.

 

Technology:

 

Instead of using conventional manufacturing techniques, this method allows for more unique and effective designs to be implemented. The design can be customized to any heat source. In addition to cooling electronic devices, the design is relevant to any thermal/fluid system in which a heat sink is utilized to dissipate losses in the form of heat. This method is able to provide significantly better cooling than its conventional counterparts. Moreover, while maintaining low pressure drop values due to its elliptical geometry, the swirling fluid allows for a more uniform cooling across the heat sink It also has improved heat rejection for similar fan flow rate, or alternatively, reduced fan power for similar heat rejection form heated elements.

 

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This invention is available for licensing.

For interested parties seeking further information, feel free to contact:

 

Mark Allen Lanoue

Technology Manager / Tech Ventures

University of Arkansas

(479) 575-7243

malanoue@uark.edu

 

Patent Information:
For Information, Contact:
Mark Lanoue
Technology Manager
University of Arkansas
479-575-7243
malanoue@uark.edu
Inventors:
David Huitink
Bakhtiyar Nafis
Reece Whitt
Keywords:
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