Search Results - zhong chen

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High Electric-Thermal Performance and High-Power Density Power Module
Technology #19-38Conventional commercial SiC power module still uses the standard packaging designed for silicon IGBT power module. Although SiC MOSFET can operate at higher frequency due to its higher switching speed compared to Si IGBT, its upper limit of switching frequency is still limited by the large parasitic due to voltage overshoot, oscillation...
Published: 11/11/2019   |   Inventor(s): Zhong Chen, Simon Ang, Junji Ke
Keywords(s):  
Category(s): All, Electric power conversion, Power Electronics
High Temperature Optoelectronic Devices for Power Electronics
Technology # 19-08HIGH TEMPERATURE OPTOELECTRONIC DEVICES FOR POWER ELECTRONICSThe present invention relates to improvements in electrical circuits. More particularly, the invention relates to improvements particularly suited for power modules.  In particular, the present invention relates specifically to a low temperature co-fired ceramic, LTCC, process...
Published: 4/30/2019   |   Inventor(s): Zhong Chen, Shui-Qing (Fisher) Yu, Homer Mantooth, Andrea Wallace, Syam Madhusoodhanan
Keywords(s):  
Category(s): All, Consumer Products, Electric power conversion, Electronic & Photonic Devices, Power Electronics
Asynchronous Circuit Stacking for Simplified Power Management
Technology # 19-03A Method for Simplified Power Management The circuit architecture described in the IP disclosure form will allow low-voltage digital circuit components to be stacked and use a higher supply voltage while operating reliably, thereby reducing the number of voltage converters needed for the system and the accompanied power loss during...
Published: 4/30/2019   |   Inventor(s): Andres Suchanek, Zhong Chen, Jia Di, Matthew Leftwich
Keywords(s):  
Category(s): All, Electric power conversion, Energy & Power, Electronic & Photonic Devices, Power Electronics
On-Chip IEC ESD Protection Using Parasitic PNP Devices
Technology #18-31The invention proposes a novel area-efficient rail-based ESD protection structureHigh speed interface ICs require both IC-level and system level ESD protections due to system exposure to static electricity discharges. On-chip ESD protections for high speed interface ICs are difficult due to the stringent pin requirements. Specifically,...
Published: 8/15/2018   |   Inventor(s): Zhong Chen, Farzan Farbiz
Keywords(s):  
Category(s): Electronic & Photonic Devices, All, Power Electronics
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