Search Results - power electronics

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High Electric-Thermal Performance and High-Power Density Power Module
Technology #19-38Conventional commercial SiC power module still uses the standard packaging designed for silicon IGBT power module. Although SiC MOSFET can operate at higher frequency due to its higher switching speed compared to Si IGBT, its upper limit of switching frequency is still limited by the large parasitic due to voltage overshoot, oscillation...
Published: 11/11/2019   |   Inventor(s): Zhong Chen, Simon Ang, Junji Ke
Category(s): All, Electric power conversion, Power Electronics
An Intelligent Multi-Level Voltage Gate Driving System for Semiconductor Power Devices
Technology # 19-27This invention enables the use of high-voltage Silicon Carbide (SiC) power MOSFETs. These devices provide various benefits such as high blocking voltages, high temperature operation, high frequency operation and low conduction and switching losses. However, with their fast switching transients come various challenges that can be detrimental...
Published: 8/21/2019   |   Inventor(s): Homer Mantooth, Shuang Zhao, Audrey Dearien
Category(s): All, Electronic & Photonic Devices, Electric power conversion, Power Electronics
Asynchronous Polymorphic Logic Gate Design
Technology # 19-33The asynchronous polymorphic logic gate design described in this IP disclosure form will allow the same digital circuit to exhibit two distinctive functionalities controlled by the supply voltage. Compared to implementing the two functionalities separately, the polymorphic design is much more efficient and provides unique advantages...
Published: 8/21/2019   |   Inventor(s): Jia Di, Chandler Bernard
Category(s): All, Consumer Products, Electronic & Photonic Devices, Power Electronics
High Temperature Optoelectronic Devices for Power Electronics
Technology # 19-08HIGH TEMPERATURE OPTOELECTRONIC DEVICES FOR POWER ELECTRONICSThe present invention relates to improvements in electrical circuits. More particularly, the invention relates to improvements particularly suited for power modules.  In particular, the present invention relates specifically to a low temperature co-fired ceramic, LTCC, process...
Published: 4/30/2019   |   Inventor(s): Zhong Chen, Shui-Qing (Fisher) Yu, Homer Mantooth, Andrea Wallace, Syam Madhusoodhanan
Category(s): All, Consumer Products, Electric power conversion, Electronic & Photonic Devices, Power Electronics
Asynchronous Circuit Stacking for Simplified Power Management
Technology # 19-03A Method for Simplified Power Management The circuit architecture described in the IP disclosure form will allow low-voltage digital circuit components to be stacked and use a higher supply voltage while operating reliably, thereby reducing the number of voltage converters needed for the system and the accompanied power loss during...
Published: 4/30/2019   |   Inventor(s): Andres Suchanek, Zhong Chen, Jia Di, Matthew Leftwich
Category(s): All, Electric power conversion, Energy & Power, Electronic & Photonic Devices, Power Electronics
Automated security patch and vulnerability remediation tool for electric utilities
Technology # 18-04 Automatic Security Patch tool for electric utilitiesThe Technology provides a machine learning-based software tool for electric utilities that can automatically recommend a re-mediation action for any security vulnerability, such as Patch Immediately and use Mitigate actions, based on the properties of the vulnerability and the properties...
Published: 4/30/2019   |   Inventor(s): Qinghua Li, Fengli Zhang, Phillip Huff
Category(s): All, Electric power conversion, Energy & Power, Power Electronics
Additively manufactured, non-conducting, convective heat removal device
Technology # 19-15A novel technology for non-conducting convective heat removalWith regards to cooling down high-powered electronics, there is a constant battle between power and weight. Ideally, we strive to achieve a powerful system while maintaining a low profile; however, in reality this extra power creates a need for more efficient cooling systems....
Published: 4/24/2019   |   Inventor(s): Reece Whitt, David Huitink, Bakhtiyar Nafis, Fang Luo
Category(s): All, Energy & Power, Power Electronics
A Technique to Reduce the Thermal Resistance of Semiconductor Substrates
Technology # 18-29A System for reducing the thermal resistance of semiconductor substratesOperation of a power semiconductor device generates a great amount of heat in the active layer which needs to be dissipated. This has been a limitation for many high power devices as the temperature for the junction cannot exceed a specific value. Not all the substrates...
Published: 3/15/2019   |   Inventor(s): Samir El-Ghazaly, Amirreza Avval, Gregory Salamo, Shui-Qing (Fisher) Yu
Category(s): All, Electronic & Photonic Devices, Energy & Power, Power Electronics
On-Chip IEC ESD Protection Using Parasitic PNP Devices
Technology #18-31The invention proposes a novel area-efficient rail-based ESD protection structureHigh speed interface ICs require both IC-level and system level ESD protections due to system exposure to static electricity discharges. On-chip ESD protections for high speed interface ICs are difficult due to the stringent pin requirements. Specifically,...
Published: 8/15/2018   |   Inventor(s): Zhong Chen, Farzan Farbiz
Category(s): Electronic & Photonic Devices, All, Power Electronics
Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling
Technology # 18-30Enhanced Heat Sink with Helical Fin Design for Electronics Cooling In electronics, an increase in heat transfer is caused by the presence of cooler fluid coming into contact with hotter fluid. In other words, as the fluid passes over the heat sink, it heats up. There is a new invention for a helical fin design heat sink that allows...
Published: 8/9/2018   |   Inventor(s): David Huitink, Bakhtiyar Nafis, Reece Whitt
Category(s): Mechanical, All, Power Electronics
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