Search Results - david huitink

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Additively manufactured, non-conducting, convective heat removal device
Technology # 19-15A novel technology for non-conducting convective heat removalWith regards to cooling down high-powered electronics, there is a constant battle between power and weight. Ideally, we strive to achieve a powerful system while maintaining a low profile; however, in reality this extra power creates a need for more efficient cooling systems....
Published: 4/24/2019   |   Inventor(s): Reece Whitt, David Huitink, Bakhtiyar Nafis, Fang Luo
Keywords(s):  
Category(s): All, Energy & Power, Power Electronics
Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling
Technology # 18-30Enhanced Heat Sink with Helical Fin Design for Electronics Cooling In electronics, an increase in heat transfer is caused by the presence of cooler fluid coming into contact with hotter fluid. In other words, as the fluid passes over the heat sink, it heats up. There is a new invention for a helical fin design heat sink that allows...
Published: 8/9/2018   |   Inventor(s): David Huitink, Bakhtiyar Nafis, Reece Whitt
Keywords(s):  
Category(s): Mechanical, All, Power Electronics
Combined integration of Phase Change Materials into Conduction Convection latent heat optimized thermal management through Novel geometries enabled in Additive manufactured heat sinks
The reliability of electronic modules depends, to a great extent, on the thermal performance of the system. As the power density of electronic modules increases, so does the heat from electrical losses. In order to avoid degradation or device failure caused by operation over maximum allowable temperature, heat must be effectively dispersed. A new design...
Published: 8/9/2018   |   Inventor(s): David Huitink, Ange Iradukunda
Keywords(s):  
Category(s): Mechanical, All, Power Electronics, Material Science
Chip Warpage Reduction via Raised Free Bending Geometries
Technology # 18-05A method for Chip Warpage Reduction A key challenge in microelectronic assembly arises when chip warpage, resulting from thermal expansion mismatch in layered materials, drives incompatibility in assembly, and can result in interfacial stresses when experiencing temperature swings native to device operation. Currently linear copper...
Published: 7/25/2018   |   Inventor(s): David Huitink, John Harris
Keywords(s):  
Category(s): Electronic & Photonic Devices, All, Power Electronics, Material Science
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